Column Distribution Analysis and RF Characterization of High-Density Vertical Interconnections Created by Magnetically Aligned Anisotropic Conductive Adhesive

In this paper, the property of a magnetically aligned anisotropic conductive adhesive (MA-ACA) is analyzed for RF applications with narrow-pitch I/O pads. An analytical approach to estimate the failure rate of this material is used based on an image-processing technique instead of direct experiment. This approach can predict efficiently the quality of developing MA-ACA and provide usable criteria in designing optimal pad size for vertical interconnects.

In addition, the column density of the created interconnect by this approach allows for more understanding of the RF characterization of a magnetically aligned ACA and extend the application range at high frequencies.