Chiplets & Advanced IC Packaging

Chiplet-based products are here.  The quest for high performance and selectivity on chiplet silicon node and the ability reused physical IP blocks in the form of chiplets continue to invent new ways to hold value.    

 A brand new advanced IC Packaging infrastructure is being created.   New package fabrication methods and new package design approaches, and new electrical test approaches have come together to permit new products.   Design tools need to comprehend multiple ICs in 2D and 3D physical configuration, functional device electric test (E-Test), and higher power densities.  IC package development to support chiplets, has been a primary focus for OSATs and Foundries in recent years,  with a rich diversity of approaches now being seen.   High-density modules are fabricated in ultra-clean environments,  where new levels of precision are required to enable very wide physical die-die buses to be created at scale and with high yield.

Today, the packaging approaches being utilized in production and development include fabrication of interposers formed from high-density copper and organic dielectrics, known as high-density fan-out (HDFO),  modules with bridges, and modules which use silicon interposers from IC fabrication sources.    These three approaches have very specific advantages and tradeoffs,  with the final goal to use the interposer that suits the product needs.   These decision criteria for module construction types need to be understood to make sure that the technical needs are met with the greatest mechanical robustness and withing the cost envelope required.  

Product augmentation for power deliver network (PDN) has created a need for innovation on proper high frequency power bypassing.   High power devices and high density power and dissipation has also push innovation in high thermal dissipation constructions, which help  define the requirements of these high-performance modules.   Mechanical robustness, both in-process warpage and stresses and solid accelerated reliability testing has been demonstrated, with ongoing work and the latest results to be discussed.