Characterization of Interfacial Reaction Layers Between a Zn-5Al-3Mg Solder Alloy and Cu Substrate

The interfacial reaction between solder and substrate is a critical factor governing joint reliability, making it essential to understand the formation and stability of interfacial reaction layers when developing new high-temperature lead-free solders. This study investigates the interfacial reaction layers formed in Zn-5Al-3Mg solder/Cu substrate joints soldered at 693 K under vacuum. With a binary Zn-Al solder, the Cu substrate is progressively consumed by Zn, and the intermediate phases CuZn4, Cu5Zn8, and CuZn nucleate and grow concurrently at the solder interface. The addition of a minor amount of Mg to the Zn-Al alloy, however, fundamentally alters this reaction sequence. Transmission electron microscopy analyses, including scanning transmission electron microscopy–energy-dispersive X-ray spectroscopy (STEM-EDS), energy-filtered TEM (EF-TEM), and electron diffraction, reveal three distinct interfacial layers: an outer Mg2Zn11 layer, a middle two-phase mixture of CuZn4/Mg2CuZn3, and an inner Cu5Zn8 layer adjacent to the Cu substrate. The biphasic CuZn4/Mg2CuZn3 mixture layer is shown to form via a quasi-peritectic reaction governed by sequential four-phase equilibria in the Zn-Mg-Cu ternary system. These findings demonstrate that minor Mg additions redirect the interfacial reaction pathway between Zn-Al-based solders and Cu substrates, providing new insight for the design of high-temperature Pb-free solder systems.