B-stageable Conductive Adhesive for Reliable Ceramic Package Assembly

This presentation will describe the development of a new epoxy-based, B-stageable conductive adhesive for ceramic packages assembly. Whereas traditionally, certain suppliers offer expensive lid-assembly solutions with often pre-applied adhesives, this paper will provide technical, logistic and commercial background on this specific development project. Furthermore, different chemical approaches are presented providing data on rheology, drying and curing characteristics. Also, depending the chosen chemistry options, the impact on health & safety considerations are presented. 

Furthermore, reliability data will be presented in comparison to initial performance data, after thermal cycling and damp heat testing of typical R&D test criteria. These results will be further supported with data on actual ceramic packages, assembled in industrial scale.