Automotive Packaging Trends - Challenges and Solutions

In the 1950’s and 1960’s electronic components started to be embedded into the automotive field, such as semiconductor transistors in car radios and power diodes in alternators. Since then, electronics have been widely adopted into many automotive applications. Many of the recent innovations in the automotive industry are the result of the use of innovative electronic devices. The use of electronics in automotive solutions has become widespread and now new applications support the engine, motor and chassis function, convenience, security and safety. Of course, these new applications have been realized through the development of innovative chip technologies but it should be recognized that packaging technologies are also playing an increasingly important role. Package technologies not only have to meet the thermal, mechanical, electrical and quality performance requirements in automotive applications but also must enable a cost effective solution for the end customer. In reality, there is no single package solution that can meet all of needs and requirements so a system integration approach is needed. The system integration approach combines chip and packaging technologies along with the know-how and knowledge taken from consumer electronics and adapts them for the harsh conditions of automotive applications. This approach is key to the successful further deployment of electronics in future automotive applications. This presentation addresses the package applications and respective reliability requirements for power electronics in automotive industries. Guidance is provided on reliability mission profiles as well as recent investigations on the use of consumer packages in automotive. Higher reliability requirements and expectations in the field of autonomous driving and electro- mobility will be the upcoming topics in automotive applications.