Analysis of Pb-free BGA Solder Joint Reliability Data

As the electronic industry has been focusing on eliminating lead (Pb) from the product manufacturing processes to meet the EU RoHS Directive, numerous studies on lead-free interconnect reliability have been published and more will be available to the public in the near future. The purposes of this study are to perform such an analysis on current available Pb-Free package reliability data to first sort out the most significant attributes and the critical areas so that more attention can be paid on them in the future; and second establish a stochastic model that can be used to predict solder joint life when a quick reliability evaluation is needed but the test results is not readily available. Based on more than 200 test data points from publications and internal qualification tests that cover a wide range of package types (FCBGA, PBGA, TBGA, etc), most commonly used lead-free solder compositions (SnAgCu, SnAg, etc), and most industry standard accelerated test conditions, this analysis helps us to better understand how Pb-free solder joint behavior under different test conditions.