DOI: 10.4071/001c.171405 ISSN: 2380-4505

AI Inference at the Data-Movement Ceiling: A Workload View of Advanced Packaging

Dong Hyuk Woo

AI inference workloads have fundamentally shifted the industry’s primary bottleneck from computation to data movement. As AI models continue to grow in size and complexity, advanced packaging technologies—including heterogeneous integration, chiplets, advanced memory architectures, and high-speed interconnects—are becoming essential to future system performance.

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