AI-Driven Process Control for Advanced Packaging

Advanced Packaging process technologies are evolving rapidly to meet the needs of High- Performance Computing (HPC) systems used in AI computing applications. Along with the process technology evolution, process control methodologies in inspection, metrology and data analytical techniques are also evolving to fabricate these valuable packages. The key challenge is that packaging fabrication steps must achieve exceedingly high yield at the same time that complexity of the packages themselves is increasing. This is driving not only the increased use of more “front-end” equipment technologies in packaging, but also evolving the methodologies in the way process control tools are used. This presentation will review not only the key challenges and solutions in process control in Advanced Packaging technologies, but also these progressing methodologies.