Ag‐Assisted Interfacial Assembly of
2D
/
0D
/
2D Ti
3
Baosong Li, Xuan Li, Shoaib Anwer, Abdallah Kamal, Dawei Zhang, Yarjan Abudul Samad, Kin Liao ABSTRACT
MXene‐based heterogeneous structures have attracted considerable attention due to their outstanding multifunctional performance in smart electronic and thermal management. In this work, 2D/0D/2D Ti 3 C 2 T x MXene/Ag@g‐C 3 N 4 composite films were fabricated by introducing 0D/2D Ag@g‐C 3 N 4 nanosheets into the Ti 3 C 2 T x matrix, forming a layered architecture featuring Ag‐mediated interfacial networks. The Ag nanoparticles function as conductive bridges between g‐C 3 N 4 and Ti 3 C 2 T x nanosheets, generating a heterogeneous structure enriched with abundant interfacial regions and strong interlayer interactions. The resulting heterogeneous films exhibit exceptional electromagnetic interference (EMI) shielding effectiveness of 51.4 dB and high absolute shielding effectiveness of 25 855 dB cm 2 g −1 . This superior EMI shielding performance stems from pronounced electromagnetic wave reflection, combined with enhanced absorption arising from local dipolar polarization, porous microstructures, and extensive interface interactions. In addition, the Ti 3 C 2 T x MXene/Ag@g‐C 3 N 4 films demonstrate robust thermal‐management capability, delivering significant infrared stealth performance (radiative temperature reduction of 137.3°C at 200°C) alongside rapid electrothermal heating to 211°C at 3.0 V. Overall, this Ag‐assisted heterogeneous assembly strategy provides a versatile pathway for engineering multifunctional MXene‐based composites that integrate EMI shielding with advanced thermal management functionalities.