DOI: 10.31399/asm.amp.2023-04.p014 ISSN:

Advancing Diffusion Bonded Compact Heat Exchangers for High Temperature Applications

Mohamed Elbakhshwan, Lukas Desorcy, Ian Jentz, Mark Anderson, Fei Gao, Todd Allen, Mark Messner, Mike McMurtrey, Jim Stubbins, John Shingledecker, Billy Nollet, Bob Keating, Suzanne McKillup
  • Mechanical Engineering
  • Mechanics of Materials
  • General Materials Science


Enhancement of the diffusion bonding process for the development of compact heat exchangers (CHXs) provides an energy efficient solution for high-temperature applications in advanced nuclear reactors and other technologies. However, available information is limited concerning the diffusion bonding (and manufacturing) of CHXs in high temperature applications and associated selection of bonded materials, bonding conditions, mechanical performance, and thermo-fluid characteristics. This article reviews the available knowledge and the ongoing research being conducted to address gaps in information and application.

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