Advancing AI with Advanced Packaging
Henley Liu, Hemanth DhavaleswarapuAdvanced packaging has become a foundational technology for AI and high-performance computing, enabling unprecedented gains in system performance, memory bandwidth, and power efficiency. Drawing on AMD’s experience in developing and deploying advanced packaging technologies—from early 2.5D products to today’s AI and data-center solutions—this presentation will discuss how heterogeneous integration, high- bandwidth memory, and advanced interconnect architectures are reshaping system design. Technical perspectives on performance scaling, power delivery, quality and reliability and manufacturing readiness will be presented. The discussion will also explore future packaging directions and their role in supporting the continued growth of AI infrastructure.