Additive Manufacturing of GNP‐Enriched Copper Feedstock via Bound Metal Deposition

In this work, a copper–graphene nanoplatelet (Cu–GNP) feedstock was developed and processed via bound metal deposition (BMD) to produce dense copper metallic parts. Rheological analyses showed that the addition of GNPs reduced the melt viscosity across the 160°C–250°C range, ensuring stable extrusion and smooth layer deposition. After solvent and thermal debinding, sintering was performed at 1050°C. The sintered samples exhibited a 92% densification relative to bulk copper, and a linear shrinkage of ∼17%–18% along all directions. The microstructure showed equiaxed grains with an average size of 23 ± 5 µm. Mechanical tests revealed an elastic modulus of 100 ± 2 GPa, yield strength of 24.6 ± 1.8 MPa, ultimate tensile strength of 62.4 ± 0.8 MPa, elongation at break of 10.8 ± 1.6%, and Vickers hardness of 22.3 HV. The electrical conductivity is 42.5 × 10 ⁶  S/m, leading to a thermal conductivity of 311.5 W/m K (from the Wiedemann–Franz law). A proof‐of‐concept 3D printed cooling fin is also presented.