A Vertically Integrated Local Oscillator Module for Millimeter-Wave Spectrum Analyzers Using a 10 kHz–100 GHz Interconnect
Yihan Zhang, Yiming Fan, Mingrui Liu, Zhongqian Niu, Zuqiang Ou, Jincai QiaoTraditional planar interconnections in RF front ends limit multilayer integration, resulting in increased module size and high-frequency losses. To address these challenges, this work proposes an ultra-wideband vertical interconnect covering 10 kHz–100 GHz and develops a miniaturized local oscillator driver module for millimeter-wave spectrum analyzers. Measurements demonstrate that the proposed interconnect achieves a return loss better than 10 dB and an insertion loss below 3 dB across the entire frequency range. A K-band interdigital bandpass filter achieves an in-band insertion loss 2.7 dB and out-of-band suppression exceeding 60 dB. Furthermore, a multilayer cavity integrates frequency multipliers, amplifiers, and filters within a compact volume of 23 mm × 20 mm × 20 mm. The proposed approach enables low-loss, high-density integration and provides a practical solution for miniaturized millimeter-wave spectrum-analyzer front ends.