Abstract In this study, a finite element model is developed to analyse the grinding force and warpage of silicon wafers during the backside grinding process. Due to the decreasing size of consumer electronic devices, such as smartphones, notebooks and portable electronics, it is necessary to address the issues pertaining to grinding silicon wafers. The backside grinding process is a mature technology that is widely used for silicon wafers. However, for ultrathin silicon wafers, warpage is a critical issue. Wafer warpage is induced by the residual stress and surface damage that arises during the backside grinding process. To analyse the grinding stress on silicon wafers during the backside grinding process, a finite element model is established by setting dynamic loads and contact conditions. An explicit dynamic model is used to simulate the relationship between the grinding wheel and the silicon wafer. A static model is incorporated with the explicit dynamic model to predict wafer warpage. The simulation results for the residual stress are in good agreement with the experimental results. The results indicate that the wheel rotational speed, wafer rotational speed and feed rate effectively control wafer warpage. Hence, the warpage of ultrathin silicon wafers can be decreased by adjusting the manufacturing process parameters. Furthermore, the developed simulation model can also be used to analyse warpage in fan-out wafers during the backside grinding process.

More from our Archive

• DOI: 10.1142/s0219455423400278 2023

  Seismic Response Control of a Nonlinear Tall Building Under Mainshock–Aftershock Sequences Using Semi-Active Tuned Mass Damper

  Liangkun Wang, Ying Zhou, Weixing Shi

• DOI: 10.1093/nargab/lqad070 2023

  Single-cell reference mapping to construct and extend cell-type hierarchies

  Lieke Michielsen, Mohammad Lotfollahi, Daniel Strobl, Lisa Sikkema, Marcel J T Reinders, Fabian J Theis, Ahmed Mahfouz

• DOI: 10.1142/s0218348x23401813 2023

  A NUMERICAL STUDY OF COMPLEX DYNAMICS OF A CHEMOSTAT MODEL UNDER FRACTAL-FRACTIONAL DERIVATIVE

  ZAREEN A. KHAN, KAMAL SHAH, BAHAAELDIN ABDALLA, THABET ABDELJAWAD

• DOI: 10.1063/5.0147231 2023

  Perspectives on adaptive dynamical systems

  Jakub Sawicki, Rico Berner, Sarah A. M. Loos, Mehrnaz Anvari, Rolf Bader, Wolfram Barfuss, Nicola Botta, Nuria Brede, Igor Franović, Daniel J. Gauthier, Sebastian Goldt, Aida Hajizadeh, Philipp Hövel, Omer Karin, Philipp Lorenz-Spreen, Christoph Miehl, Jan Mölter, Simona Olmi, Eckehard Schöll, Alireza Seif, Peter A. Tass, Giovanni Volpe, Serhiy Yanchuk, Jürgen Kurths

• DOI: 10.1111/biom.13907 2023

  Optimal test procedures for multiple hypotheses controlling the familywise expected loss

  Willi Maurer, Frank Bretz, Xiaolei Xun

• DOI: 10.34133/cbsystems.0051 2023

  Integrated Design Fabrication and Control of a Bioinspired Multimaterial Soft Robotic Hand

  Samuel Alves, Mihail Babcinschi, Afonso Silva, Diogo Neto, Diogo Fonseca, Pedro Neto

• DOI: 10.1063/5.0146808 2023

  A simple modeling framework for prediction in the human glucose–insulin system

  Melike Sirlanci, Matthew E. Levine, Cecilia C. Low Wang, David J. Albers, Andrew M. Stuart

• DOI: 10.1111/mafi.12413 2023

  Deep order flow imbalance: Extracting alpha at multiple horizons from the limit order book

  Petter N. Kolm, Jeremy Turiel, Nicholas Westray

• DOI: 10.1142/s0219455424500937 2023

  Size-Dependent Electro-Thermal Buckling Analysis of Flexoelectric Microbeams

  Yaghoub Tadi Beni

• DOI: 10.1177/02783649231187670 2023

  Autonomous navigation of underactuated bipedal robots in height-constrained environments

  Zhongyu Li, Jun Zeng, Shuxiao Chen, Koushil Sreenath