A Comparative Study on the Insulation Properties of Different Epoxy Materials for UHV DC Bushing Insulators
Xining Li, Hao Tang, Kai Liu, Huichuan Tang, Yi Zhang, Guangning WuUltra-high-voltage direct-current (UHVDC) transmission systems impose stringent requirements on the reliability of insulation materials used in converter transformer bushings. Epoxy resin systems are key insulating materials in resin-impregnated paper (RIP) capacitor bushings, and their processing characteristics, curing behavior, and electrical properties directly affect bushing performance. In this study, two epoxy insulation systems used for resin-impregnated paper (RIP) bushings, namely the imported Araldite LY1564/Aradur 3486 system and the domestic EP-2020/CA-3015 system, were systematically investigated through viscosity, curing, and electrical property tests. The results show that the viscosities of both resins decreased significantly with increasing temperature. At 60 °C, the viscosities of Resin A and Resin B were 151.6 mPa·s and 156.3 mPa·s, respectively. The mixed resin–hardener systems exhibited similar viscosity evolution and comparable pot life characteristics. DSC measurements revealed two-stage curing reactions for both materials, with first exothermic peak temperatures of 65.4 °C and 96.3 °C and second peak temperatures of 269.3 °C and 269.8 °C for Materials A and B, respectively. Electrical testing demonstrated that both materials exhibited similar temperature-dependent dielectric and resistivity behavior, with dielectric loss increasing at elevated temperatures and resistivity decreasing as temperature increased. The volume resistivity trends and dielectric characteristics of the two materials remained highly consistent throughout the investigated temperature range. The results indicate that Material B exhibits processing performance, curing characteristics, and electrical insulation properties comparable to those of Material A. Therefore, Material B demonstrates strong potential for application in UHVDC RIP bushing insulation systems and provides a promising alternative for the localization of key insulating materials.