A 100 Gbps High‐Speed Differential Ceramic BGA Hermetic Package With Heat Sink Structure

ABSTRACT

Cu‐conductor low‐temperature co‐fired ceramic (LTCC) CBGA is proposed for high‐speed chips requiring broadband signals and cooling. It integrates 20 differential lanes. The dual‐bend fan‐out suppresses LC parasitics, with ≥15 dB return loss DC–67 GHz for 100 Gbps PAM4. Through‐cavity direct cooling and opposite‐side heat sink/BGA layout overcome LTCC thermal defects; recessed sealing avoids ball‐shortage. Thermal resistance drops from 8.3°C/W (pure LTCC) to 0.6°C/W with the MoCu insert.