DOI: 10.1002/sdtp.16753 ISSN:
75‐2: Failure Mechanisms and Optimum Methods for Through Glass Via
Qichang An, Yuelei Xiao, Qiuxu Wei, Yifan Wu, Huiying Li, Yue Li- General Medicine
Due to high insulation, low dielectric loss and low cost, glass is considered as a promising substrate material for advanced package. Through glass via technology plays a key role in the 2.5D and 3D packaging. This paper analyzes failure mechanisms of TGV and discuss the optimum design and process.