DOI: 10.1002/sdtp.16753 ISSN:

75‐2: Failure Mechanisms and Optimum Methods for Through Glass Via

Qichang An, Yuelei Xiao, Qiuxu Wei, Yifan Wu, Huiying Li, Yue Li
  • General Medicine

Due to high insulation, low dielectric loss and low cost, glass is considered as a promising substrate material for advanced package. Through glass via technology plays a key role in the 2.5D and 3D packaging. This paper analyzes failure mechanisms of TGV and discuss the optimum design and process.

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