DOI: 10.1039/d3ra03839d ISSN:
Direct adhesion between Cu foil and polytetrafluoroethylene without increasing surface roughness for high-frequency printed wiring boards
Misa Nishino, Takumi Kodama, Kazuya Yamamura, Yuji Ohkubo- General Chemical Engineering
- General Chemistry
The strong adhesion between Cu foil and polytetrafluoroethylene was obtained by heat-assisted plasma treatment and thermal compression under the reduced pressure.